TCL Commands to build chip level padringsΒΆ
The following commands can be used from the command prompt to define the padring structure for the chip.
Once the padcells have been added, the padring can be built using the initialize_padring command.
Use the place_cell command to pre-place additional cells in the floorplan.
Full examples of how to use these commands together to build a chip:
Example for chip with wirebond padring
Example for chip with flipchip bumps
Alternatively, the information needed to build chip-level padrings can be bundled up into a separate file and loaded in batch fashion